L’adhérence de films de polyimide utilisés comme diélectriques en microélectronique^(*)

Adhesion of polyimide films used as dielectric interlevel in microelectronics

¹ CEMOTA, Vernaison
² CNET, Meylan

Abstract

Polyimides, due to their simple spincoat processing, planarizing properties, thermal stability and good dielectric properties [1], are today beeing increasingly used as interlevel dielectric and/or passivation layers in the microelectronics industry. However, because of their water retention, their adhesion to silicon remains problematic with time.

In this work, four adhesion testing methods have been studied, and two of them have proved to be significant : the Peel-test and Deckert methods. These methods have been compared in terms of adhesion and ageing measurements and their results show a good correlation.