Matériaux & Techniques

A new high strength gold bond wire - Nouveau fil d'or à haute résistance pour applications électroniques

G. Humpston and D. M. Jacobson

Matériaux & Techniques, 81 6 (1993) 25-32

Published online: 13 April 2017

DOI: 10.1051/mattech/19938106025

G. Humpston

D. M. Jacobson

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