Articles citing this article

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The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).

Cited article:

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, et al.
Journal of Electronic Materials 35 (11) 2048 (2006)
https://doi.org/10.1007/s11664-006-0312-9

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee and Kyung-Wook Paik
Journal of Electronic Materials 33 (10) 1210 (2004)
https://doi.org/10.1007/s11664-004-0124-8