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Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee and Kyung-Wook Paik
Journal of Electronic Materials 33 (10) 1210 (2004)
DOI: 10.1007/s11664-004-0124-8
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Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jeong-Tak Moon and Kyung-Wook Paik
Journal of Electronic Materials 35 (11) 2048 (2006)
DOI: 10.1007/s11664-006-0312-9
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