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Cited article:

Les métaux réfractaires déposés en phase vapeur pour interconnexions dans les circuits intégrés - (Deuxième partie)

Y. Pauleau

Matériaux & Techniques, 77 9-10 (1989) 31-34

Published online: 2017-04-19

DOI: https://doi.org/10.1051/mattech/198977090031

PDF (583 KB)

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