Étude XPS de l’interface polyimide/aluminium. Influence du promoteur d’adhérence^(*)

Investigation of the interfacial properties between aluminium surfaces and polyimide by means of XPS

Laboratoire d’analyses des structures et surfaces, IBM France, Corbeil-Essonnes

Abstract

We used Al substrates either treated with a silane adhesion promoter (APS) or untreated, followed by spin application of polyamic acid formulation (PAA). The interesting features observed are : 1) APS is adsorbed in a dissociative fashion onto the surfaces, 2) different adsorption mechanisms exist depending on the surface contamination, 3) PAA is adsorbed onto both the APS-treated and untreated surfaces, 4) as expected, PAA cures into polyimide (PI), 5) silicon species (from APS) in different oxidation states can be detected in the PAA and PI films. This suggests that the Al-APS-PAA bonding configuration is not Al-O-Si—NH₂-PAA, as it is commonly accepted, and that APS is unlikely an efficient coupling agent for Al-PAA adhesion.