Matériaux & Techniques

L’adhérence de films de polyimide utilisés comme diélectriques en microélectronique

J. Nechtschein and A. Schiltz

Matériaux & Techniques, 76 (1988) 13-15

Published online: 21 June 2017

DOI: 10.1051/mattech/198876120013s

J. Nechtschein

A. Schiltz

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