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Cited article:
L. Lavielle , J. Schultz
Matériaux & Techniques, 72 6-7 (1984) 215-222
Published online: 2017-04-19
This article has been cited by the following article(s):
9 articles
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Adhesion mechanisms of enamel–varnishes on copper: Adhesion promoter versus corrosion inhibitor
C. Boullanger, J. P. Chapel, L. Danel and J. Fournier Journal of Applied Polymer Science 89 (4) 952 (2003) https://doi.org/10.1002/app.12164
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Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces
M. Gundjian and B. Fisa Journal of Thermoplastic Composite Materials 10 (5) 416 (1997) https://doi.org/10.1177/089270579701000501
Adhesion at copper- polyamide 11- copper and aluminum-poly amide 11-aluminum laminate interfaces: influence of metal surface oxidation
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Adhesion mechanisms of grafted polyolefins
J. Schultz and L. Lavielle Makromolekulare Chemie. Macromolecular Symposia 23 (1) 343 (1989) https://doi.org/10.1002/masy.19890230130
Comportement électrique des interfaces polyéthylène‐métal en liaison avec l'adhésion
Lisette Lavielle, Jean‐Louis Prévot and Jacques Schultz Die Angewandte Makromolekulare Chemie 169 (1) 159 (1989) https://doi.org/10.1002/apmc.1989.051690115
In-situ metallization of polypropylene films pretreated in a nitrogen or ammonia low-pressure plasma
V André, F Arefi, J Amouroux, et al. Thin Solid Films 181 (1-2) 451 (1989) https://doi.org/10.1016/0040-6090(89)90514-2